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| CSPEMI204 2 Channel Headset EMI Filter with ESD Protection Features * * * * * * * * Two channels of EMI filtering, one for a microphone and one for an earpiece speaker Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Chip Scale Package features extremely low parasitic inductance for optimum filter performance Greater than 30dB relative attenuation in the 8002700MHz range 8kV ESD protection on each channel (IEC 610004-2 Level 4, contact discharge) 15kV ESD protection on each channel (HBM) 5-bump, 0.930mm X 1.410mm footprint Chip Scale Package (CSP) Lead-free version available Product Description The CSPEMI204 is a low-pass filter array designed specifically to reduce EMI/RFI emissions and provide ESD protection for a headset port on a cellular and mobile devices. The CSPEMI204 integrates two high quality, pi-style filters (C-R-C) filters, one for a microphone and one for an earpiece or speaker, each providing more than 30dB attenuation relative to the pass band attenuation in the 800-2700 MHz range. These filters support bidirectional filtering, reducing EMI both to and from the headset port and support bipolar audio signals without distortion. In addition, the CSPEMI204 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The CSPEMI204 can safely dissipate ESD strikes of 8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 15kV. The CSPEMI204 protects sensitive components such as CPU and DSPs that have much weaker internal ESD protection circuitry usually only intended for mechanical handling protection. The CSPEMI204 is particularly well-suited for portable electronics because of its small package format and low weight. The CSPEMI204 is available in a spacesaving, low-profile Chip Scale Package with optional lead-free finishing. Applications * * * * * * EMI filtering and ESD protection for headset microphone and earpiece speaker ports Cellular / Mobile Phones Notebooks and Personal Computers Handheld PCs / PDAs / Tablets Wireless Handsets Digital Camcorders Electrical Schematic Earpiece A1 Input 10 C1 Earpiece Output Microphone A3 Input 68 C3 Microphone Output 100pF 100pF GND B2 (c) 2005 California Micro Devices Corp. All rights reserved. 09/28/05 47pF 47pF 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.cmd.com 1 CSPEMI204 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking (see note 2) BOTTOM VIEW (Bumps Up View) 123 A A3 A1 EAR_IN AE MIC_IN Orientation Marking B C B2 GND C3 MIC_OUT C1 EAR_OUT Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. CSPEMI204 CSP Package PIN DESCRIPTIONS PIN A1 A3 B2 C1 C3 NAME EAR_IN MIC_IN GND EAR_OUT MIC_OUT DESCRIPTION Earpiece Input (from audio circuitry) Microphone Input (from microphone) Device Ground Earpiece Output (to earpiece) Microphone Output (to audio circuitry) Ordering Information PART NUMBERING INFORMATION Standard Finish Bumps 5 Package CSP Ordering Part Number1 CSPEMI204 Part Marking AE Lead-free Finish2 Ordering Part Number1 CSPEMI204G Part Marking AE Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. (c) 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 1A www.cmd.com 09/28/05 CSPEMI204 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 300 UNITS C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL R1 R2 C1 C2 ILEAK VSIG PARAMETER Resistance Resistance Capacitance Capacitance Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency 1; Note 5 Cut-off frequency 2; Note 5 VIN=5.0V ILOAD = 10mA 5 -15 7 -10 CONDITIONS MIN 9 54 80 38 TYP 10 68 100 47 MAX 11 75 120 57 1.0 15 -5 UNITS pF pF A V V kV kV VESD Notes 2 and 4 15 8 Notes 2,3 and 4 +15 -19 R = 10, C = 100pF R = 68, C = 47pF 33 61 VCL V V MHz MHz fC1 fC2 Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: The parameters are guaranteed by design. Note 5: ZSOURCE=50, ZLOAD=50 (c) 2005 California Micro Devices Corp. All rights reserved. 09/28/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.cmd.com 3 CSPEMI204 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Earpiece Circuit (A1-C1) EMI Filter Performance Figure 2. Microphone Circuit (A3-C3) EMI Filter Performance (c) 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.cmd.com 09/28/05 CSPEMI204 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Maximum Soldering Temperature for EutecticDevices using Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using Lead-free Solder Paste VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 240C 260C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 3. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 4. Eutectic (SnPb) Solder Ball Reflow Profile (c) 2005 California Micro Devices Corp. All rights reserved. 09/28/05 Figure 5. Lead-free (SnAgCu) Solder Ball Reflow Profile 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.cmd.com 5 CSPEMI204 Mechanical Details CSP Mechanical Specifications The CSPEMI204 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CMD's Chip Scale Package, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams BOTTOM VIEW A1 B2 B1 C B A A2 C1 B4 B3 SIDE VIEW PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 5 Inches Nom Max 123 0.885 0.930 0.975 0.0348 0.0366 0.0384 1.365 1.410 1.455 0.0537 0.0555 0.0573 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.165 0.215 0.265 0.0065 0.0085 0.0104 0.220 0.270 0.320 0.0087 0.0106 0.0126 0.562 0.606 0.650 0.0221 0.0239 0.0256 0.356 0.381 0.406 0.0140 0.0150 0.0160 3500 pieces 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI204 Chip Scale Package C2 D1 D2 # per tape and reel Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CSPEMI204 CHIP SIZE (mm) 1.41 X 0.93 X 0.606 POCKET SIZE (mm) B0 X A0 X K0 1.52 X 1.07 X 0.72 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") 10 Pitches cumulative tolerance on tape 0.2 mm QTY PER REEL 3500 P0 4mm P1 4mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment P1 User direction of feed Center lines of cavity Figure 6. Tape and Reel Mechanical Data (c) 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.cmd.com 09/28/05 |
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